This is the last step in the DVD creation process.

With our DVD Project having been Compiled, there are a set of files that DVD-lab has prepared for you in the Output folder as set in the Compile process. At this point, the DVD Author has choices as to how to convert this set of files into a DVD master disc. You can either use the DVD-lab built-in recording module or you can choose to use a third party DVD recording software such as Nero, Prassi, Gear, etc..

It is common that you are supplied with a DVD recording software that was bundled with your DVD-R/DVD+R burner. This software may be better optimized for your particular drive. The DVD-lab built-in DVD recording module is a general ASPI writing application and should work fine. In an ideal world, either one would work equally well.

**DVD-lab Disc record window
The DVD-lab Disc record window is automatically detached. That means it runs as a separate process independent from DVD-lab, you could even close DVD-lab and the recording will continue.

Here are some of the parameter choices for the DVD-lab Disc record window.

**Input Folder
The Input Folder is the same as the Output folder in Compile. That means this is the folder where the VIDEO_TS and AUDIO_TS folders are expected to be

**Device
The DVD recording drive you want to write to, presented as the O/S recognizes it.

**Media Type
Set if you want to burn DVD Video or a Mini-DVD.Mini-DVD is a DVD format burned on the CD-R. Obviously you can put far less data on a CD-R (about 700 MB) than on DVD (4.3 GB)

The size indicator on the bottom can help you to determine how much data you can record to the disc. You have to keep your data below the red area.

**Note:

While you will be able to play the CD-R on a computer not all standalone players will be able to play the Mini-DVD. In fact such format is not officially supported. The reason is that CD's have far less density of data so in order to play the large DVD video bitrate they have to spin much faster than DVD. Not all DVD drives in players are ready for this so the functionality to DVD files from CD-R is often simply disabled. However a number of Asian or re-branded Asian US models of players use a standard PC type of DVD drive which allows for fast spin of CD.

**DVD-RW/DVD+RW Tools

For those using a re-writable media, the DVD-RW needs to be formatted if they were already used - click the Erase/Format button to do this. The more common DVD-R media do not need any formatting.
The DVD-RW and +RW needs to be finalized after writing. This takes quite a large amount of time on RW media. Please be patient until this important process is completed.

**Test Write checkbox

Use this option by checking the Test Write checkbox to have DVD-lab do a trial run at writing a DVD. This option does not write anything to disk or your hard drive, it merely goes through the motions to insure that all of the content and menus within the DVD project are correctly prepared and defined.

**Volume Name input
Enter here a name for the DVD volume that will appear when placed in a computer drive. A standalone DVD player just ignores this

**Create Image checkbox

You can choose to have DVD-lab create a large file on your hard drive which is an the image of a DVD disc instead of burning. The result will be one big IMG file. That IMG file can be used with a number of third party DVD recording software to replicate a DVD disc from this image file, as many times as you like, whenever you like. Some software will look for a ISO file name extension, if so, just rename the file to a .ISO extension. This method has the advantage of speed as the DVD image is all prepared on your hard drive, it is then a just matter of how fast your DVD burner drive will burn that image.

**Hybrid DVD Writing button

You can add additional files and folders to the DVD master disc with the Hybrid DVD Writing option. What this option will do is setup an alternate filesystem on the DVD master disc which is called an ISO filesystem. The ISO format is what a standard CD uses while the DVD video is in UDF/ISO. This is perfectly DVD "legal" as the DVD player doesn't know or care about this ISO filesystem's contents, it just looks for a UDF filesystem.
It doesn't matter at all what the content or nature of these files are. They are just files, not Windows or Mac or Linux files, just files. As they are recorded into the ISO file system domain, they are available on any computer with a DVD drive. This offers the DVD-lab Author some creative options for bonus content that would be available to a computer user on any O/S that supports a DVD drive.

For example, you can create an autorun project in Multimedia Builder and record it to DVD as an extra feature when used on PC. HTML based content may be placed here as well, be sure to indicate to your computer users where to find your HTML starting page (ex: index.html).

Note: The space used by the Hybrid DVD Writing option counts in the entire Project space value. You only get so much space on a DVD (4.7G), this option uses part of that. Do the math to be sure you have room for this extra area.

**Write button

As expected, click this button to start the DVD writing (burn) process.

** Congratulations - now it is up to you to enjoy the DVD. **

S.E.C.C. Package Type

S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.

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PPGA Package Type

PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.

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PGA Package Type

PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.

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OOI Package TypeOOI

is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.

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FC-PGA Package TypeThe FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.

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FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

FC-LGA4 Package Type

The FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket.The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket.

** FAcToRS oF moTHeRboARD **

Mini-ITX is a 17 x 17 cm low-power motherboard form factor developed by VIA Technologies. Mini-ITX has similarities to ATX, microATX, FlexATX and BTX form factors, but is significantly smaller: 170 mm (6.7 inches) by 170mm. Mini-ITX boards can often be passively cooled due to their low power consumption architecture, which makes them useful for home theater systems, where fan noise can detract from the cinema experience.

History

In March 2001, VIA (a chipset manufacturer) released a reference design for an ITX motherboard, to promote the low power C3 they had bought from Cyrix, in combination with their chipsets. Designed by Robert Kuo, VIA's chief R&D expert, the 215 mm x 191 mm VT6009 ITX Reference Board was demonstrated in "Information PC" and set-top box form factors. He would later go on to design the Mini-ITX form factor. The ITX form factor was never taken up by manufacturers, who instead produced smaller boards based on the very similar 229 mm x 191 mm FlexATX form factor.

In October 2001, VIA announced their decision to create a new motherboard division, to provide standardised infrastructure for lower-cost PC form factors and focus on embedded devices. The result was the November 2001 release of the VT6010 Mini-ITX reference design, once again touted as an "Information PC", or low cost entry level x86 computing platform. Manufacturers were still reticent, but customer response was much more receptive, so VIA decided to manufacture and sell the boards themselves. In April 2002 the first Mini-ITX motherboards—VIA's EPIA 5000 (fanless 533 MHz Eden processor) and EPIA 800 (800 MHz C3)—were sold to industrial customers.

microATX, also known as µATX (sometimes transliterated as mATX^[1] or uATX^[2][3] on online forums) is a small form factormotherboards, with a maximum size of 244 mm × 244 mm (9.6 inches x 9.6 inches), but some uATX boards can be as small as 6.75 inches by 6.75 inches or 171.45 millimeters by 171.45 millimeters^[4]. The standard ATX size is 25% longer, at 305 mm × 244 mm (12" wide x 9.6" deep). standard for computer

Currently available microATX motherboards support CPUs from VIA, Intel or AMD. There are no known microATX motherboards for processor architectures other than x86 and x86-64.

Backward-compatibility

microATX was explicitly designed to be backward-compatible with ATX. The mounting points of microATX motherboards are a subset of those used on full-size ATX boards, and the I/O panel is identical. Thus, microATX motherboards can be used in full-size ATX cases. Furthermore, most microATX motherboards generally use the same power connectors as ATX motherboards,^[5] thus permitting the use of full-size ATX power supplies with microATX boards.

microATX boards often use the same chipsets (northbridges and southbridges) as full-size ATX boards, allowing them to use many of the same components. However, since microATX towertower cases, they usually have fewer I/O ports and expansion slots. cases are typically much smaller than ATX

BTX (for Balanced Technology Extended) is a form factor for PC motherboards, originally slated to be the replacement for the aging ATX motherboard form factor in late 2004 and early 2005. It has been designed to alleviate some of the issues that arose from using newer technologies (which often demand more power and create more heat) on motherboards compliant with the circa-1996 ATX specification. The ATX and BTX standards were both proposed by Intel. Intel's decision to refocus on low-power CPUs, after suffering scaling and thermal issues with the Pentium 4, has added some doubt to the future of the form factor. The first company to implement BTX was Gateway Inc, followed by Dell. Although not marketed as such, Apple's Mac Pro utilizes the BTX design as well. However, future development of BTX retail products by Intel was canceled in September 2006.

<<< BTX CASE

The ATX (for Advanced Technology Extended) form factor was created by Intel in 1995. It was the first big change in computer case and motherboardAT completely as the default form factor for new systems. ATX addressed many of the AT form factor's annoyances that had frustrated system builders. Other standards for smaller boards (including microATX, FlexATX and mini-ITX) usually keep the basic rear layout but reduce the size of the board and the number of expansion slot positions. In 2003, Intel announced the new BTX standard, intended as a replacement for ATX. As of January 2007 the ATX form factor remains the industry standard for do-it-yourselfers; BTX has however made inroads into pre-made systems, being adopted by computer makers like Dell, Gateway, and HP. design in many years. ATX overtook. The official specifications were released by Intel in 1995, and have been revised numerous times since, the most recent being version 2.2[1], released in 2004.